Professional Certificate in
Advanced Techniques for Material Analysis

This course will equip learners with the following competencies:

• To understand the principles of thin-film deposition to advance epitaxial growth techniques and their applications in the microelectronics and lighting industry.
• To examine advanced characterization techniques for materials analysis, covering techniques ranging from macroscopic to nanoscopic length scales.
• To apply advanced analytical techniques for material analysis. Possible techniques include: X-ray photoelectron spectroscopy; Auger electron spectroscopy. X-Ray diffraction, Ion Beam analysis and Mass spectroscopy, Raman spectroscopy; Scanning Electron Microscopy; Transmission Electron Microscopy; X-ray Energy Dispersive Spectroscopy; Rutherford Backscattering and PIXE.
• To perform basic interpretation of measured spectrum that would be encountered in analysis and authentication arising from manufacturing and production of advanced and emerging materials and devices.